TEC-Cu

TEC | Copper

Cold Spray | Thermal & Electronic Conductivity

Spherical copper powder designed for applications requiring high thermal and electrical conductivity.

Material
Copper
Geometry
Spherical
Porosity
< 0.5% (N2)
Depostion Rate
21% (N2)
Cohesion Strength
14.2ksi
*All mechanical properties are as-sprayed
D10D25D50D75D90
17 25 39 54 66

This pure copper powder is suitable for a wide variety of high-pressure cold spray applications but is optimized for deposition using either helium or nitrogen as the carrier gas to achieve high-level performance. Data shown above reflects properties achievable with nitrogen. Powder is spherical and has excellent flow characteristics. Powder is packaged in mylar bags ranging from 1-10 lbs each. Each lot of powder is characterized to ensure quality with a shelf life of 3 years.

An error has occurred. This application may no longer respond until reloaded. Reload 🗙