TEC-xCu-W

TEC | Copper

Thermal & Electronic Conductivity | Cold Spray

Powder in development process

Material
Copper
Geometry
Angular
*All mechanical properties are as-sprayed
D10D25D50D75D90
5 0 15 0 30

A tungsten-based powder that is electroplated with copper to improve the deposition efficiency of pure tungsten for cold spray applications. The concentration of copper can be varied in the range of 5-30wt pct copper

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